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Product Name: |
GT-FC300-1.1
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Specifications |
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Price Term: |
fob |
Port of loading: |
shenzhen |
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GT-FC300-1.1 Flip Chip for High Bay High Bay Lights LEDs Flip Chip GT-FC300(SP1010) Power:FC60-300W Luminous area:13.48*13.48mm RoHS compliant 5 Years Warranty High CRI COB LED Chip Description High Reliability and Stability Ceramic base with flip chip mounted, no gold wire bonding High heat conductivity red copper substrate High temperature eutectic welding technique Reliable raw materials applied with super fast heat transfer Patented phosphor coating techonology Outstanding Projecting Performance High power & lux density with super even light distribution Minimum distance in-between China Flip Chip for High Bay to achieve surface emitting effect Extremely small LES optimized for focused lighting purpose Flexible Application Features of High Stability Flip Chip Equipped with temperature sensor and quick connector A wide power range from 10W to 800W optional High Bay Light Flip Chip Application: stage light, projector, searchlight and long-distance lighting applications,etc Product Specification Product Type LES (mm) CCT (K) CRI&©|160; ¦Õ £¨lm£© Power (W) VF (V) IF (A) Chip Array GT-FC60X3-1.1 6.66*6.66 8000-8500 70 4500-5000 60 15-19 3.75 SP0505 GT-FC90X3-1.1 6.66*6.66 8000-8500 70 6300-7200 90 15-19 5.5 SP0505 GT-FC150X3-1.1 9.64*9.64 8000-8500 70 10000-12000 150 21-25 6.7 SP0707 GT-FC300X3-1.1 &©|160;13.48*13.48 8000-8500 70 20000-22000 300 30-36 10 SP1010 |
Company: |
Shenzhen Getian Opto-electronics Co., Ltd.
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Contact: |
Ms. Flora Chen |
Address: |
Blg 55, Baotian 3rd Road East, Baotian Industrial Park, Xixiang, Bao'an District Shenzhen |
Postcode: |
518102 |
Tel: |
13265654351 |
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